The invention provides a semiconductor device and a manufacturing method
thereof where mounting strength and accuracy can be improved without
making processes complex. Grooves are formed on a back surface of a
semiconductor substrate along a dicing line. Via holes are formed
penetrating the semiconductor substrate from its back surface to pad
electrodes. Embedded electrodes are then formed in the via holes, and a
wiring layer connected with the embedded electrodes is formed extending
to a region near a dicing line. Conductive terminals are formed at end
portions of the wiring layer. Then, dicing is performed along the dicing
line to complete the semiconductor device having inclined surfaces at end
portions of its back surface. When the semiconductor device is connected
with the circuit board by a reflow process, conductive paste having
increased fluidity covers the conductive terminals and the inclined
surfaces. The conductive paste having side fillets are formed on the
circuit board around an outer edge of the semiconductor device.