The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

 
Web www.patentalert.com

< Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

> Semiconductor device with slanting side surface for external connection

> Electrical connection pattern in an electronic panel
~ 00504