A solder pad configuration for use in an IC package is described. Various embodiments of the invention describe IC packages, lead-frames, or substrate panels configured with generally noncircular solder pads at their bottom surfaces. The noncircular shapes allow for greater surface area than circular solder pads having diameters equal to a major dimension of the noncircular shapes, while maintaining the same metal-to-metal clearance between the pads and adjacent leads. This increased surface area provides for stronger and more reliable solder joints.

Web www.patentalert.com

< Pinned electronic package with strengthened conductive pad

< Layered resistance variable memory device and method of fabrication

> Structures and methods for integration of ultralow-k dielectrics with improved reliability

> Flip-chip device having conductive connectors

~ 00281