Semiconductor devices having a passivation layer formed over their major electrodes and individual electrical connectors connected to the electrodes by conductive attach material through openings in the passivation layer are described.

 
Web www.patentalert.com

< Solder pad configuration for use in a micro-array integrated circuit package

< Structures and methods for integration of ultralow-k dielectrics with improved reliability

> Integrated process tube and electrostatic shield, assembly thereof and manufacture thereof

> Pixel cell voltage control and simplified circuit for prior to frame display data loading

~ 00281