An electronic package and information handling system utilizing same
wherein the package substrate includes an internally conductive layer
coupled to an external pad to provide reinforced adhesion of the pad to
the substrate to substantially prevent cracking, separation, etc. of the
pad when the pad has a pin bonded thereto and the package is coupled to
an external substrate (e.g., printed circuit board). The reinforced
adhesion also prevents pad separation, etc. during periods of package
handling, manufacture, etc.