A semiconductor component includes a chip on board leadframe, a semiconductor
die
back bonded and wire bonded to the leadframe, an encapsulant on the die and an
area array of terminal contacts on the leadframe. The leadframe includes leadfingers,
interconnect bonding sites for wire bonding the die, terminal bonding sites for
the terminal contacts, and bus bars which electrically connect selected leadfingers
to one another. The interconnect bonding sites are located on the leadframe relative
to the bus bars such that shorting to the bus bars by wire interconnects is eliminated.
A method for fabricating the component includes the steps of attaching the die
to the leadframe, bonding the wire interconnects to the die and to the interconnect
bonding sites, forming the encapsulant, and then forming the terminal contacts
on the terminal bonding sites.
