Semiconductor device and method of manufacturing the same

   
   

A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

 
Web www.patentalert.com

< Semiconductor component having chip on board leadframe

< Flip-chip assembly with thin underfill and thick solder mask

> Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration

> Semiconductor die package

~ 00185