A passive component is realized on-die by fabricating a first conductor
from either a layer of interconnect metal comprising copper or aluminum
and being between approximately 1.0 micron and approximately 2.0 microns
thick, or from a layer of under bump metal comprising either copper or
aluminum and being between approximately 2.0 microns to approximately 5.0
microns thick. Following, a first isolation layer is formed over the first
conductor. A second conductor having at least one external pad and
comprising under bump metal is next fabricated over the first isolation
layer. The second conductor can be fabricated substantially directly above
the first conductor, for example. Thereafter, a second isolation layer
having a hole over the external pad of the second conductor is formed over
the second conductor. Subsequently, a bump attach site is fabricated at
the hole in the second isolation layer over the external pad of the second
conductor.
