A flip-chip component includes a chip with pads located on the chip and a chip frame, wherein the chip frame is arranged around the chip and is attached to the chip so that the active surface of the chip is substantially planar with a surface of the chip frame. A redistribution layer is attached to the chip and chip frame, and interconnections mechanically connect the redistribution layer and a board. Aspects of the invention improve the reliability of the flip-chip package by reducing shear stresses in the interconnections between the package and a board during changing temperatures. This is achieved by carefully selecting the material of the chip frame and designing the placement of the interconnections so that thermal expansion of the package matches that of the board during changing temperatures.