An electrical circuit material having a conductive layer disposed a
substrate, wherein the substrate comprises an organic or inorganic
polymer comprising a covalently bound polyhedral silsesquioxane (POSS).
The substrate may further comprise an additional dispersed POSS, any
other fillers including fibrous webs. Use of covalently bound POSS allows
for flame retardancy in compositions having acceptable dielectric
constants and dissipation factors.