A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling tubes 2. The plurality of cooling tubes 2 is arranged and stacked in such a fashion as to interpose the electronic components 6 between the cooling tubes. The plurality of cooling tubes 2 includes an outside cooling tube 2b and an inside cooling tube 2a. The inside cooling tube 2a includes at least a first coolant flow passage 211 facing a first tube wall 231 constituting a first main surface 221 of the inside cooling tube 2a and a second coolant flow passage 212 facing a second tube wall 232 constituting a second main surface 222 on the opposite side to the first main surface 221. The coolant flow passage 21 is formed into two or more stages in a direction of thickness of the inside cooling tube 2a.