A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect in physical and electrical contact with the substrate contact configured to provide a signal path to a back side of the semiconductor substrate. The through interconnect includes an opening in the semiconductor substrate aligned with the substrate contact, and a projection on an interposer substrate (or alternately on a second semiconductor substrate) configured for mating physical engagement with the opening in the semiconductor substrate. The projection can also include a conductive via configured for electrical contact with a backside of the substrate contact and with a terminal contact for the component.