[Problem to be Solved]A piezoelectric device is provided in which, when the piezoelectric device is miniaturized, drive level characteristics are favorable, stress does not remain in a bonding portion of a housing body, and a factor causing deterioration of characteristics does not remain.[Solution]A piezoelectric device includes a base substrate 54, a resonator element 55 with a frame, and a lid 56 layered over and fixed to the resonator element with a frame, in which the base substrate, the resonator element with a frame, and the lid are all formed from a same material. The resonator element 55 with a frame includes a resonator element main body 32 and a frame section 53. Each bonding surface bonding the base substrate, the resonator element with a frame, and the lid is bonded by surface activation bonding and hermetically sealed. An electrode for driving of the resonator element main body 32 is routed to the frame section as an extraction electrode. As a result of bonding, the extraction electrode of the frame section is electrically connected to a mounting electrode serving as an external terminal provided on the base substrate, via a conductive pattern formed on the bonding surface of the base substrate.