An optoisolator device is shown having a die attachment device with a planar surface. A first circuit die has first and second planar surfaces and a first side surface. A receiver circuit and a first photodiode are formed on the first planar surface of the first circuit die, where the first photodiode is electrically coupled to the receiver circuit. The second planar surface of the first circuit die is attached to the planar surface of the die attachment device. A second circuit die has a transmitter circuit that includes a first light emitting diode and is attached to the die attachment device in a position adjacent to the first side surface of the first circuit die. A clear plastic layer is formed on the planar surface of the die attachment device over the first and second circuit dies. An opaque layer may be formed over the clear plastic layer.