A microelectromechanical component and to a method for the production
thereof is disclosed. In one embodiment, the microelectromechanical
component has a pressure-sensitive semiconductor chip, which is covered
in its pressure-sensitive region by a rubber-elastic layer and is
arranged in a cavity housing and covered by a rubber-elastic covering.
This rubber-elastic covering has a greater thickness than the
rubber-elastic layer on the pressure-sensitive region.