Output pads on an integrated circuit (IC) chip are arranged along a first
longer side and are arranged along a second longer side with input pads.
The output pads are connected to respective output patterns formed on top
and bottom surfaces of a base film. All the output patterns may pass over
the first longer side. Alternatively, the output patterns connected to
the output pads at the second longer side may pass over a shorter side.
These pattern structures establish an effective pad arrangement without
increasing the size of a TAB package, yet allowing reduced the chip size.