A component for fabricating the electronic device comprises a substrate
and a conductive film provided on the substrate, in which the adhesion of
the conductive film to the substrate is not greater than 0.1 N/cm. The
adhesion of the conductive film to the substrate is weak enough to enable
the conductive film to be readily peeled from the substrate. This makes
it possible to form a component on a substrate other than the substrate
used during film formation, thereby greatly increasing the degree of
product configuration freedom. If the adhesion of a lower conductive film
on the substrate side is made to be not greater than 0.04 N/cm, it
becomes very easy to peel the conductive film from the substrate.