An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the surface, a periphery of each of the plurality of extensions being spaced away from the peripheral wall, the plurality of extensions further comprising a first group of extensions and a second group of extensions, each of the first group of extensions having a greater peripheral area than a peripheral area of each of the second group of extensions and the first group of extensions being aligned with a portion of an integrated circuit disposed on another surface of the base, the portion of the integrated circuit generating a higher heat flux than other portions of the integrated circuit, and a plate secured to the elevated perimeter, the plate the plate covering the plurality of extensions and further comprising an inlet opening and an outlet opening.

 
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< Chip support of a leadframe for an integrated circuit package

> Circuit board, device mounting structure, device mounting method, and electronic apparatus

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