A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

 
Web www.patentalert.com

< Integrated circuit chip and method for cooling an integrated circuit chip

> Method, system, and apparatus for gravity assisted chip attachment

~ 00454