A chip package and fabricating method thereof are provided to maintain the thermal dissipating efficiency and reduce the damage to the chip. The edge of the exposed portion would be cracked caused by external force because of the substrate of the chip is brittle. The crack in the edge of the chip will degrade the reliability and induce the malfunction of the chip. In this case, the chip is disposed at least one elastic element at the edges of the exposed side to reduce the risk of the crack in the chip.