A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conductive adhesive layer and a heat-dissipating layer. The substrate includes an opening extending between a first surface and a second surface of the substrate. An integrated circuit is to be mounted on the first surface of the substrate substantially coincident with the opening. The thermally-conductive adhesive layer is at least partially disposed within the opening in the substrate. The heat-dissipating layer is disposed on the second surface of the substrate and includes a raised portion that at least partially extends through the opening in the substrate.