A method is disclosed for completing a flip chip package design by
re-using mask designs in a tool library. The method comprises analyzing
one or more input/out bump locations of a chip, analyzing one or more
solder ball locations of a package hosting the chip with regard to a
predetermined printed circuit board, and designing the package hosting
the chip by using a tool library containing one or more existing mask
designs for re-use, wherein when one or more existing mask designs are
used for the package, at least one custom connection layer of the package
is redesigned when needed for connecting the chip to the printed circuit
board without producing a full set of new masks for the package.