To easily determine an orientation of a semiconductor device, a semiconductor device includes a substrate including electrode electrically connected to an integrated circuit, an external terminal electrically connected to the electrode, and a light transmissive insulation layer provided on the external terminal side of the substrate, and a mark provided on the substrate and covered by the insulation layer and recognizable through the insulation layer.

 
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< Semiconductor package with pattern leads and method for manufacturing the same

< Carrier for substrate film

> Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof

> Array substrate having double-layered metal patterns and method of fabricating the same

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