A device containing a flat member is provided, having a pattern for a bonding pad, a wiring, and an electrode, by half-etching through the flat member.

 
Web www.patentalert.com

< Carrier for substrate film

< Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

> Array substrate having double-layered metal patterns and method of fabricating the same

> Package for mounting semiconductor device

~ 00226