Methods and apparatuses are provided for protecting an interconnect line in a microelectromechanical system. The interconnect line is disposed over a substrate for conducting electrical signals, such as from a bonding pad to a mechanical component to effect movement as desired of the mechanical component. A first protective covering is disposed over a first portion of the interconnect line and a second protective covering is disposed over a second portion of the interconnect line. The first protective covering is provided in electrical communication with the substrate and the second protective covering is electrically isolated from the substrate.