The invention relates to a material including carbon, oxygen, silicon and hydrogen
and having a dielectric constant of from about 2.1 to about 3.0 where an FTIR scan
of the material includes at least two major peaks signifying Si—CH3
bonding. The invention further relates to a material which has a variable dielectric
constant through the thickness of the material. Another aspect of the invention
is the method of making the material.
