The invention provides methods and apparatus for drying the backside of semiconductor wafers in a spin-coating environment. Solvent is evaporatively dried from a semiconductor wafer held in a spin mechanism. The undried wafer is sprayed with one or more jets of pressurized gas from gas ports disposed about the spin mechanism.

 
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> Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques

> Strained silicon on insulator from film transfer and relaxation by hydrogen implantation
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