A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 m/m C. between -40 and 150 C. and a modulus of from 1 to 300 MPa at 25 C., and the silicone member is prepared by the method of the invention.