The present invention introduces several methods for implementing arbitrary angle
wiring layers for integrated circuit manufacture with simulated Euclidean wiring.
Entire routing layers may be implemented with arbitrary angle preferred wiring
using simulated Euclidean wiring. In a first embodiment, the arbitrary angle wiring
layers are created by routing arbitrary angle wires created from a selected ratio
alternating segments of horizontal interconnect wire segments and vertical interconnect
wire segments. In another embodiment, the arbitrary angle wiring layers are created
by routing arbitrary angle wires created from a selected ratio alternating segments
of horizontal interconnect wire segments and diagonal interconnect wire segments.