An assembly having a surface mounted electronic device mounted onto a printed
circuit board and a thermoplastic adhesive applied to the surface mounted electronic
device facing the printed circuit board and providing for a gap between the thermoplastic
adhesive and the printed circuit board. The assembly is heated at solder reflow
temperatures to at least soften the thermoplastic adhesive sufficiently to flow
across the gap and provide a thermoplastic adhesive joint between the surface mounted
electronic device and the printed circuit board.
