A semiconductor component includes a die having a pattern of die contacts, and
interconnect contacts bonded to the die contacts and encapsulated in an insulating
layer. The component also includes terminal contacts formed on tip portions of
the interconnect contacts. Alternately the component can include conductors and
bonding pads in electrical communication with the interconnect contacts configured
to redistribute the pattern of the die contacts. A method for fabricating the component
includes the steps of forming the interconnect contacts on the die contacts, and
forming the insulating layer on the interconnect contacts while leaving the tip
portions exposed. The method also includes the step of forming the terminal contacts
on the interconnect contacts, or alternately forming the conductors and bonding
pads in electrical communication with the interconnect contacts and then forming
the terminal contacts on the bonding pads.
