An element such as a semiconductor wafer or other body is provided with flexible
leads, the tip ends of which project over the front surface of the element. The
tips of the flexible leads are spaced apart from the front surface and are independently
moveable with respect to the element. The flexible leads may be curved in a plane
parallel to the front surface of the element, or may be curved so that the tip
end of each flexible lead is disposed further from the front surface of the element
than the main body of the flexible lead.
