Nitride semiconductor device and a process of manufacturing the same

   
   

The luminous efficiency of a nitride semiconductor device comprising a gallium nitride-based semiconductor layer formed on a dissimilar substrate is improved. An n-type layer formed on the substrate with a buffer layer interposed between them comprises a portion of recess-and-projection shape in section as viewed in the longitudinal direction. Active layers are formed on at least two side faces of the projection with the recess located between them. A p-type layer is formed within the recess. An insulating layer is formed on the top face of the projection, and on the bottom face of the recess. The n-type layer is provided with an n-electrode while the p-type layer is provided with a p-electrode contact layer. As viewed from the p-type layer formed within the recess in the gallium nitride-based semiconductor layer, the active layer and the n-type layer are located in an opposite relation to each other. As viewed from the side face of the recess, the active layer and the p-type layer are formed across the n-type layer.

Улучшена светящая эффективность прибора на полупроводниках нитрида состоя из галлия нитрид-osnovala сформированный слой полупроводника на несходном субстрате. Слой н-tipa сформированный на субстрате при слой буфера interposed между ими состоит из части формы гнезд-и-proekqii в разделе в продольном направлении. Активно слои сформированы на по крайней мере обеих сторонах стороны проекции при гнездо расположенный между ими. Слой п-tipa сформирован в пределах гнезда. Изолируя слой сформирован на верхней стороне проекции, и на нижней стороне гнезда. Слой н-tipa обеспечен с н-3lektrodom пока слой п-tipa обеспечен с слоем контакта п-3lektroda. От слоя п-tipa сформировал в пределах гнезда в нитрид-osnovannom галлием слое полупроводника, активно слое и слой н-tipa устроен в противоположном отношении to each other. От бортовой стороны гнезда, активно слой и слой п-tipa сформированы через слой н-tipa.

 
Web www.patentalert.com

< Guard ring for direct photo-to-electron conversion detector array

< Mount for semiconductor light emitting device

> Colors only process to reduce package yield loss

> Method and apparatus for forming a capacitive structure including single crystal silicon

~ 00171