Semiconductor wafer protection and cleaning for device separation using laser ablation

   
   

A method of protecting and cleaning a semiconductor wafer using laser ablation includes the following steps: applies a protective coating on the side to be cut of a wafer with sapphire substrate, mounts the other side of the sapphire wafer on an adhesive tape, mounts the sapphire wafer on a cutting table, cuts the sapphire wafer with a laser, breaks the sapphire wafer into die, and cleans the sapphire wafer with a cleaning solution that removes slag resulting from the cutting, debris resulting from the breaking, and the protective coating, but the adhesive tape, the cleaning solution, and the protective coating are selected such that the cleaning solution does not damage the adhesive tape.

Um método de proteger e de limpar um wafer de semicondutor que usa o ablation do laser inclui as seguintes etapas: aplica um revestimento protetor no lado para ser corte de um wafer com carcaça do sapphire, monta o outro lado do wafer do sapphire em uma fita adesiva adesiva, monta o wafer do sapphire em uma tabela do corte, corta o wafer do sapphire com um laser, quebra o wafer do sapphire no dado, e limpa o wafer do sapphire com uma solução da limpeza que remova o slag resultando do corte, dos restos resultando de quebrar, e do revestimento protetor, mas a fita adesiva adesiva, a solução da limpeza, e o revestimento protetor são selecionados tais que a solução da limpeza não danifica a fita adesiva adesiva.

 
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