MEMS and MEMS components from silicon kerf

   
   

The disclosure describes an economical and environmentally benign method for using crystalline silicon metal kerf recovered from wiresaw slurries towards the fabrication of complex MEMS and MEMS components, including MEMS packages, with improved design features.

El acceso describe un método económico y ambientalmente benigno para usar el corte cristalino del metal del silicio recuperado de las mezclas del wiresaw hacia la fabricación de los componentes complejos de MEMS y de MEMS, incluyendo los paquetes de MEMS, con las características del diseño mejoradas.

 
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