Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing page

Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing

An evaluating pattern is comprised of a conductive pattern which has a rectangular configuration, an insulating layer which is formed on the conductive pattern, and a conductive material filled into contact holes which is formed in the insulating layer on the middle of the conductive pattern.

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