Connecting structure and frequency adjusting method therein

   
   

A connecting structure for high frequency circuits is provided, with which components can be readily replaced, and which does not require high assembly accuracy and is applicable in a broad band. First and second circuit boards each having strip lines on top surfaces thereof are placed to secure a gap therebetween. Patch portions each constituting a resonator are formed by extending the width of the strip lines, and a supporting member of a foam material is placed on the top of the patch portion formed on the first circuit board. A parasitic element made of a dielectric material is cantilevered by the supporting member. The free end side of the parasitic element is placed above the patch portion formed on the second circuit board while securing a predetermined space between the parasitic element and this patch portion. A strong electrical connection is established by the parasitic element that electromagnetically couples non-continuing portions, thereby making it possible to cut a direct current.

 
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> Dielectric laminated device and manufacturing method thereof

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