The present embodiments provide surface mount devices and/or systems. In
some embodiments, the surface mount devices comprise a casing with a
recess in a second surface; a first lead element partially encased by the
casing comprising a coupling portion extending interior to the casing
generally in a first direction and a chipset portion extending from the
first coupling portion at a first acute angle and through an area exposed
by the recess; a second lead element partially encased by the casing
comprising a second coupling portion extending interior to the casing in
a second direction substantially parallel to the first direction and a
head portion extending from the second coupling portion at a second acute
angle and partially terminating interior to the area exposed by the
recess; and the chipset portion comprises a first indentation and a
second indentation both extending into the area exposed through the
recess.