A semiconductor device with a chip (505), its position defining a plane,
and an insulating substrate (503) with first and second surfaces; the
substrate is substantially coplanar with the chip, without warpage. One
of the chip sides is attached to the first substrate surface using
adhesive material (504), which has a thickness. The thickness of the
adhesive material is distributed so that the thickness (504b) under the
central chip area is equal to or smaller than the material thickness
(504a) under the peripheral chip areas. Encapsulation compound (701) is
embedding all remaining chip sides and the portions of the first
substrate surface, which are not involved in the chip attachment. When
reflow elements (720) are attached to the substrate contact pads, they
are substantially coplanar with the chip.