It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use.The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

 
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< Polymeric dispersants based on addition of amines to dialkylsuccinyl succinate or its derivatives

> Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.0.sup.4,8] nonan-3-one ring and photoresist resin composition

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