A polymeric compound of the invention includes at least one monomer unit represented by the following formula (I); ##STR00001## wherein R.sup.a is a hydrogen atom, a halogen atom, an alkyl group of 1 to 6 carbon atoms or an haloalkyl group of 1 to 6 carbon atoms; each of R.sup.1 and R.sup.2 is identical to or different from a hydrogen atom or a hydrocarbon group, provided that at least one of R.sup.1 and R.sup.2 is a hydrocarbon group; R.sup.1 and R.sup.2 may be bonded together to form a ring with an adjacent carbon atom; and each of R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8 and R.sup.9 is identical to or different from a hydrogen atom or a hydrocarbon group. This polymeric compound has not only high substrate adhesion and high etching resistance but also high solubility for a resist solvent.