A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the printed circuit board in contact with the waterblock cooling device and the clamp plate. A method is disclosed for connecting together a heat sink assembly and a component, the method comprising inserting standoffs of a clamp plate through passage holes in a printed circuit board; inserting the standoffs of the clamp plate through clearance holes in a waterblock cooling device; and positioning a spring component in contact with the clamp plate and the waterblock cooling device so as to position the printed circuit board in contact with the waterblock cooling device and the printed circuit board in contact with the clamp plate.