Die probing devices can include multiple sets of probe wires, where
certain probe wires correspond to test pads and other correspond to bond
pads. The probe wires can be electrically coupled to each other using
either a space transformer or a probe card, to provide appropriate
continuity. Probe wires can generally be arranged in numerous different
patterns depending upon (for example) pad layout, wire configuration,
wire type, and probe head design/manufacturing constraints.