In one embodiment, a tester interface module for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board having center conductor vias with center conductor holes extending through the capture board. Axial cables secured to the capture board have center conductors extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.