A thermal protection system (TPM) for protecting a surface subject to high thermal load comprising a fiber substrate where the substrate is composed of woven or non-woven layers of fibers laminated together, or the substrate is formed by a process of three-dimensional weaving, wherein the fiber substrate has a variable density of fibers, with said density of fibers increasing across the thickness of the TPM, and further wherein the substrate is needled and coupled to an insulation backing.

 
Web www.patentalert.com

< Optical recording medium

< Delivery of muscle relaxants through an inhalation route

> Materials and methods for detection and treatment of breast cancer

> Semiconductor wafer and its manufacturing method

~ 00204