Processing tools, components of tools, and methods of making and using
such devices for electrochemical processing of microelectronic workpieces. One
aspect of the invention is directed toward reaction vessels for electrochemical
processing of microelectronic workpieces, processing stations including such reaction
vessels, and methods for using these devices. For example, one embodiment of a
reaction vessel includes an outer container having an outer wall, a first outlet
configured to introduce a primary fluid flow into the outer container, and at least
one second outlet configured to introduce a secondary fluid flow into the outer
container separate from the primary fluid flow. The reaction vessel can also include
at least one electrode, and it can also have a field shaping unit. The field shaping
unit, for example, can be a dielectric assembly coupled to the second outlet to
receive the secondary flow and configured to contain the secondary flow separate
from the primary flow through at least a portion of the outer container. The field
shaping unit can also have at least one electrode compartment through which the
secondary flow can pass separately from the primary flow. The electrode is positioned
in the electrode compartment.
