A bottom heat dissipating device may be attached to a bottom surface of a printed
circuit board (PCB). A top surface of the bottom heat dissipating device may be
thermally coupled with a backside surface of one or more electronic components
mounted on the bottom surface of the PCB. A top heat dissipating device may be
attached to a top surface of the PCB. The top heat dissipating device may be thermally
coupled with the bottom heat dissipating device through a thermally conductive
coupling member to provide a conductive path for heat transfer from the bottom
heat dissipating device to the top heat dissipating device. An opening adjacent
to an edge of the thermally conductive coupling member may allow air flow between
the top and bottom heat dissipating devices. The PCB may be part of a mezzanine
card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).
