A light emitting diode comprising a light emitting diode element 20 mounted
on a glass epoxy substrate 12, this light emitting diode element 20 being
protected at its surface side by a resin seal member 33, in which: a light
emitting diode element for blue luminescence, formed of gallium nitride type compound
semiconductor is used as the above-mentioned light emitting diode element 20;
and a fluorescent material containing layer 21 composed of a fluorescent
material containing layer 21 composed of a fluorescent material dispersed
into an adhesive is arranged on the back side of this light emitting diode element.
On the back side of the light emitting diode element 20, blue luminescence
is converted in wavelength to produce white luminescence of high intensity.
