A work chamfering apparatus includes a work holding portion. The work holding
portion
includes a work table and a clamper. The work table has an upper surface having
two end portions each formed with holding grains projecting out of the upper surface.
The two end portions of the upper surface of the work table have a static friction
coefficient greater than 0.1, which is greater than that of a center portion. When
chamfering, first, the work is held by the work table and a generally U-shaped
member of the clamper. At this time, the two end portions of the upper surface
of the work table contact a lower surface of the work, whereas lower surfaces of
respective end portions of the U-shaped member contact an upper surface of the
work. In this state, a rotating center of the work is between the lower surfaces,
and the lower surfaces are apart generally equally from the rotating center. Next,
a tool including a first grinding stone and a second grinding stone is lowered,
and the first grinding stone chamfers an upper edge of the work. Then, the tool
is moved off and raised, and then the second grinding stone chamfers a lower edge
of the work.
