Disclosed is a halogen-free resin composition comprising: (A) one or more
phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator;
(D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener
of component B has the structure represented by the following formula (I):
##STR1##
wherein each symbol is as defined above. The halogen-free resin composition
of the present invention without adding halogen has excellent heat resistance and
flame retardant property, and excellent dielectric property. The halogen-free resin
composition of the present invention is particularly useful in the application
of bonding sheets, composite materials, laminated plates, printed circuit boards,
copper foil adhesives, inks used for build-up process, semiconductor packaging
materials and the like.
